Copper pillar
Cu Pillar
A copper pillar is a bump structure with a copper column as its main body, connecting die contacts to mating contacts.
In context
A solder cap at the tip commonly forms the bond. Because the pillar supports height, its deformation behavior differs from an all-solder bump.
Example
Copper's good conductivity alone cannot guarantee reliability of the entire joint. Check the solder interface, stress transfer, and substrate structure as well.
Key distinction
Examine the copper column's role separately from the interface forming the actual bond.
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