BGA
Ball Grid Array
BGA is an external terminal structure with solder balls arranged in a grid on the package bottom.
Other learning contexts (4)
In context
It uses area rather than placing terminals only at edges. Different internal connection methods, such as wire bonding or flip-chip, may be used.
Example
The BGA name alone does not establish that the internal die is attached face down. Verify the external terminal format and die bonding method separately.
Key distinction
BGA describes the external connection arrangement; it is not a synonym for an internal connection technology.
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