Wire-bonded structure
A wire-bonded structure connects die bond pads to contacts on a substrate or leadframe using fine metal wires.
In context
A representative arrangement places the die's circuit face upward and connects wires to surrounding contacts. Wire height and length affect space and electrical properties.
Example
Some products stack multiple dies and expose pads in steps for wire connections. Die stacking does not necessarily mean TSV stacking.
Key distinction
Understand wire structures by considering die placement and contact accessibility together.
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