Flip-chip structure
A flip-chip structure places the die's connection face downward and directly connects it to mating contacts through bumps.
In context
Contacts can cover the entire die face, reducing long wire loops. However, the mating substrate and bump array must align precisely.
Example
A flip-chip die may still use BGA for external connections. Flip-chip and BGA are structures that can be combined, rather than competing categories on one axis.
Key distinction
Read short internal bump connections separately from the external ball array.
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