UBM
Under Bump Metallization
Under Bump MetallurgyUnder-bump Metallurgy
UBM is a metal layer structure between a die bond pad and a bump, providing required functions such as adhesion, diffusion control, and wetting.
Other learning contexts (1)
In context
It manages reaction and adhesion problems that may arise from attaching solder directly to bond pad metal. Multiple metal layers may serve different roles.
Example
Damaged UBM may weaken the interface or create electrical problems even with a normal bump shape. Check the metal layer configuration for the product process.
Key distinction
Beneath the bump's external shape is a metal structure that stabilizes the interface.
Explore this field
View map ↗22 planned packsView packs ↗
L0 OverviewL1 FoundationsL2 Advanced
