Bump
A bump is a protruding metal structure formed on a contact to connect a die with a mating contact.
Other learning contexts (2)
In context
It provides an electrical path and mechanical connection, with configurations such as solder or copper pillars with solder caps. Not every bump has the same material or size.
Example
External BGA solder balls and fine bumps for die bonding are both connections, but differ in location and dimensions. Check image magnification together with what is being connected.
Key distinction
Describe a bump with its material, location, and bonding targets together.
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