Reflow
Reflow heats and melts solder to connect bonding surfaces, then cools it.
Other learning contexts (2)
In context
Heating, hold, and cooling histories change wetting, interface reactions, and thermal stress. Validated conditions suited to the alloy and product are required.
Example
Even with the same peak temperature number, different overall thermal histories may produce different bonds. Do not use educational explanations as actual equipment recipes.
Key distinction
Reflow is an entire thermal process over time, rather than one peak temperature point.
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