Thermal Interface Material

TIM

TIM fills interfaces between dies, lids, heat sinks, and other parts to improve heat transfer.

Other learning contexts (6)

Conceptual package cross-section locating a die, thermal interface material and heat spreader — Relative locations of TIM and the heat spreader above a die. Orange emphasizes a local heat source, not a measured temperature field. Layers and dimensions are not to scale; the final cooling path outside the spreader is omitted.

In context

Microscopic gaps can exist between surfaces that appear flat. TIM fills them, but its own thickness and thermal conductivity also create thermal resistance.

Example

Applying more material is not always better. Secure the required contact while meeting verified thickness and compression conditions.

Key distinction

TIM reduces air gaps while also contributing its own thermal resistance.

From the same lessons

Backgrinding Reflow Dielectric layer Build-up substrate Curing shrinkage HBM stack PHY Die-to-wafer bonding

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