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2.5D integration

2.5D integration places multiple dies side by side on an intermediate connection structure and connects them through high-density interconnects.

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2.5D integration · Semiconductor Packaging & HBM

Conceptual 2.5D arrangement of adjacent dies on an interposer, with a separate bridge alternative — Dies are arranged laterally on an intermediate connection structure. The bridge on the right is a separate alternative, not an extra installed part in the left assembly. Fine wiring, TSV construction, material composition and actual dimensions are not shown.

In context

Dies sit beside one another but use denser intermediate interconnects than an ordinary board. This is a representative approach for connecting HBM stacks with accelerator dies.

Example

Vertical stacking within HBM and 2.5D placement in an integrated package do not contradict each other. Both apply depending on which connection segment is being described.

Key distinction

Draw vertical connections within HBM separately from lateral connections to the accelerator.

From the same lessons

Pitch conversion Flip-chip structure Singulation Bump pitch Redistribution layer Underfill Capillary underfill Wafer-level packaging

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