Underfill
Underfill fills narrow gaps between a die and a mating structure to support joints.
Other learning contexts (5)
In context
It helps distribute loads caused by thermal expansion differences between silicon and the substrate. Electrical signals mainly pass through metal joints, while typical underfill fills their surroundings.
Example
Filling void space does not mean every underfill has the same thermal conductivity or elasticity. Joint gaps and material properties must suit each other.
Key distinction
Metal carries electrical connections; surrounding materials adjust the connections' mechanical environment.
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