Warpage
Warpage is a state in which a wafer or package bends away from an ideal plane.
Other learning contexts (5)
In context
Differences in thermal expansion among materials, curing shrinkage, thickness, and asymmetric structures contribute. Warpage magnitude and direction can vary with temperature.
Example
A structure flat at room temperature may have bonding contact problems if warpage increases at reflow temperature. Check its state across the process temperature range.
Key distinction
Interpret flatness assessments together with the temperature at which the structure is used or bonded.
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