BEOL
Back End of Line
BEOL is the process domain that forms multilayer metal interconnects and interlayer insulating structures to connect devices.
Other learning contexts (1)
In context
Lines in the same layer provide lateral connections, while vertical connections called vias connect different interconnect layers. Alternating metal and insulating films provides electrical connections only where needed.
Example
The “back end” in BEOL refers to interconnect processing on a wafer. Do not use it as a synonym for the entire assembly and packaging process that cuts chips and connects external terminals.
Key distinction
BEOL creates connections and insulation together; it is not simply a matter of filling structures with large amounts of metal.
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