Known Good Die (KGD)
Known Good Die
KGD
A die confirmed with high confidence to meet required performance and quality through sufficient wafer/die-stage testing before package assembly.
In context
Because 2.5D/3D packages combine multiple dies, one defective die can cause the loss of the entire package, making KGD particularly important.
Example
Dies for HBM or chiplet packages are screened through high-speed wafer-stage testing so that only KGD enters assembly. Related terms: Wafer sort / High-bandwidth memory / Chiplet / Yield
Key distinction
KGD is a concept of die test quality before packaging; it does not always mean simply passing wafer testing once.
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